innakako@orange.ocn.ne.jp, inoue-patent@tokyo.email.ne.jp, inoue@urban-pat.com, inter.ctt@msa.hinet.net, intnagai@yc5.so-net.ne.jp, invenco@hn.vnn.vn, investip.hn@hn.vnn.vn, investpro.ip@hn.vnn.vn, investpro@fpt.vn, inyk@inyk.com, ip-firm@tsukuni.gr.jp, ip.department@cvclaw.com, ip@ambys-hanoi.com, ip@iplcca.com, ip@ipsol.com.mo, ip@kamata-patent.jp, ip@muhann.com, ip@ramrais.com, ip@shobayashi.com, ip@takaokalaw.com, ipdept@taie.com.tw, ipgroup@mail.ilct.co.th, ipindia@gmail.com, iplaw@leemock.com, ipman@tke.att.ne.jp, ipo7326@da2.so-net.ne.jp, ipphil@info.com.ph, ipr@kass.com.my, ipr@li-young.com.tw, ipr@srlegals.com, ipris@vsnl.net, iprlaw@iprbor.com, iprlouis@ms15.hinet.net, ipsayhwa@sayhwa.com, irene.ng@atl-legal.com, ireneswng@yahoo.com, isha.kohli@chadhaandchadha.com, ishibashi@intect.net, ishida_j@yki.jp, ishihara_keisaku@patent.gr.jp, ishikawa@intect.net, ishwang@giplaw.co.kr, isjeon@sojong.com, islee@leepark.net, isshikik@sepia.ocn.ne.jp, itaya-pat@mue.biglobe.ne.jp, ito@hazuki-pat.com, itoh-h@imypatent.jp, itoh@aoyamapat.gr.jp, itohpat@itohpat.co.jp, itohpatent@itohpatent.com, iton@oslaw.org, iuchi.int.ip@gol.com, ivanrajkovic@shelstonip.com, iwamoto@harukapat.jp, iwasa@ariga.co.jp, izs00237@nifty.com, j-kimu@taiyo-nk.co.jp, jacey@sltnet.lk, jacintaflattery@shelstonip.com, jahuu@naver.com, jakarta@iprights.com, james.cherry@freehills.com, james@jcipgroup.com.tw, james@mail.fblaw.com.tw, jameswan@wilgrist.com, jan@hastings-hk.com, januar@jahja.com, japamarkogura@nifty.com, jasdev@ipjasdev.com, jason.chan@amicalaw.com, jatin@yjtrivedi.com, javed.tanwiri@vellani.com, jawhwa@jaw-hwa.com.tw, jaya@anandandanand.com, jayathri.kulatilaka@fjgdesaram.com, jbj@ipdraju.com, jcc@jcc-cheung.com.hk, jch@iphyun.co.kr, jckimpat@hotmail.com, jco@kcllaw.com, jcollison@iprights.com, jcs5356@hotmail.com, jcurwen@davies.com.au, jdhk@jonesday.com, jdobbin@fbrice.com.au, jdsung@ip.kimchang.com, jeannewang@tsartsai.com.tw, jeegesh@klaw.in, jeevejay@gmail.com, jeff.winch@callinans.com.au, jeffrey.mclean@deacons.com.hk, jeffreyhung@sfks.com.hk, jekal@philonzi.com, jennifer.mcewan@ekmpatent.com.au, jenniferlin@tsartsai.com.tw, jeongdae.lee@bkl.co.kr, jern@advanz.com.my, jezzmine.fewins@clyde.com.hk, jgbdadvo@bom3.vsnl.net.in, jgreenekelly@marks-clerk.com.sg, jhhan@primepat.com, jhheo9@jhheo.com, jhjeong7@hanmail.net, jhk@leeko.com, jhk@leemock.com, jhkim@leeinternational.com, jhl@bkl.co.kr, jhlee1@ip.kimchang.com, jhogan@fbrice.com.au, jhp@mspat.co.kr, jhpark@yschang.co.kr, jhw@yilhaepat.com, jhyoon2@ip.kimchang.com, jimlim@jimlimpartnership.com, jinsollaw@jinsollaw.com, jitsuhiro@shigapatent.com, jitsuzo_kinoshita@kinoshita-pat.co.jp, jiuan@wipo.com.tw, jjw@jwpat.com, jka@sogapat.com, jkim@pluspatent.com, jkp@mspat.co.kr, jkpark@youme.com, jks4u4u@yahoo.co.kr, jkshin@leeinternational.com, jmassang@piperpat.com, jmkim@pankoreaip.com, jnakashima@giplaw-osaka.co.jp, jnegler@davies.com.au, joann.see@amicalaw.com, joanne@intellect-worldwide.com, joaoe@mdme.com.mo, john.brass@sprusons.com.au, john.chen@taiwanlaw.com, john.dower@freehills.com, john.glengarry@buddlefindlay.com, john.hackett@ajpark.com, john.mccann@sprusons.com.au, john.mccormack@griffithhack.com.au, john.slater@simmons-simmons.com, john.terry@ellisterry.com, john@srilankalaw.com,
 johnforster@shelstonip.com, johnk@wray.com.au, johnredfern@shelstonip.com, joho@kabasawa.com, jonathanfoong@infinituslaw.com.sg, jonathankok@khattarwong.com, josecochingyan@cochingyanperalta.com, joseph.kwok@hmcip.com.au, joseph@bharuchaco.com, joseph@wmleehk.com, joy.pan@bakernet.com, joyceho@tsartsai.com.tw, jp@ishidapo.com, jperez@iplaw.ph, jpetering@fbrice.com.au, jpiper@piperpat.com, jrogers@jaws.co.nz, jsahn@ip.kimchang.com, jsaito@ishidapo.com, jsb@kspat.com, jschang@philonzi.com, jschoi@sspat.com, jservice@ihug.co.nz, jsjeong@leeinternational.com, jslattery@davies.com.au, jsp@hanyanglaw.com, jsyun@aiplaw.com, juheekim@lnkip.com, julie.ismail@vellani.com, jungjin@jjpat.com, jungpat@neitpat.com, juriz_adv@juliusrizaldi.co.id, justec@hanmir.com, justin.davidson@dlapiper.com, justin.simpson@pctfiler.com, jwarner@fbrice.com.au, jwlee@firstlaw.co.kr, jws@asiapat.com, jwspat@jwspat.com, jwykong@gmail.com, jwyoon@hsip.co.kr, jyan@netvigator.com, jyeshta@shearndelamore.com, jyjung@daewoong.co.kr, jykim@ssgpat.com, jyml@rbjl.com, jyoti@knspartners.com, jyparkmj@hotmail.com, k-kato@taiyo-nk.co.jp, k-muraki@ip-mandm.com, k-ueki@usfi-pat.gr.jp, k.kuruma@sugi.pat.co.jp, k.sugimura@sugi.pat.co.jp, k_abe@taniabe.co.jp, k_ando@asamura.jp, k_asai@nakapat.gr.jp, k_asamura@asamura.jp, k_iida@nakapat.gr.jp, k_izawa@nakapat.gr.jp, k_kanai@asamura.jp, k_matsuo@nakapat.gr.jp, k_yoshida@nakapat.gr.jp, kaa@kaiguchi.com, kaji@kajis.co.jp, kallayarat@chavalitlaw.com, kamada@kamada-pat.com, kamata@siks.jp, kameya@hazuki-pat.com, kamoda_patent@dol.hi-ho.ne.jp, kanchana@juliusandcreasy.com, kandan@shearndelamore.com, kang@kangpat.com, kangcj@paran.com, kangpat@kangpat.com, kanoh-pto@pop06.odn.ne.jp, kanpat@mui.biglobe.ne.jp, kapil@singhandsingh.com, kapunanlaw@kapunanlaw.com, karanpal.singh@amarchand.com, karen.spark@pof.com.au, karen@shearndelamore.com, kartini.muljadi@kmuljadi.com, kasame@kasamelaw.com, katayama@aiklaw.co.jp, katayama@tech.email.ne.jp, kato@okabeintl.gr.jp, katos@oslaw.org, katsumi@aoyamapat.gr.jp, katsunuma-hirohito@kyowapatent.co.jp, katsurada@chizai.net, katuki-udpo@msa.biglobe.ne.jp, kawa@esakipat.co.jp, kawamura@harukapat.jp, kawase@sankyo-pat.gr.jp, kawashima-m@soei-patent.co.jp, kaz@kidopat.gr.jp, kazuaki.tasaka@teva.jp, kbt@aqanchetalaw.ph, kc.service@king-craft.com.tw, kc0519@unitel.co.kr, kcan@ip.kimchang.com, kckim@seshinpat.co.kr, kdj@kspat.com, kdlee@ip.kimchang.com, keeleng@kltan.com.sg, keepat@leeinternational.com, keiko.kawakami@intelix.jp, keith.borg@halfords.com.au, ken.hamilton@pof.com.au, ken.mcinnes@hmcip.com.au, kenichi.nakayama@bakernet.com, kenji.yokouchi@harukapat.jp, kenneth.weng@gigabyte.com.tw, kenzopat@mars.dti.ne.jp, kevin.hung@gigabyte.com.tw, kevin@woodwu.com.tw, kfyu@lawyer.com, khadate@par.odn.ne.jp, khawar.pasha@vellani.com, khawja.mansoor@vellani.com, khayase@hayase.co.jp, kherk.ying.chew@wongpartners.com, khi@vellani.com, khkim@21cpat.com, khkim@kbkpat.com, khl@hanyanglaw.com, khoshikawa@asamura.jp, khpaek@firstlaw.co.kr, khs@asklaw.co.kr, khushnum.muncherji@vellani.com, kijdhana@kijdhana.com, kikuchi51@pat.hashizume.com, kikuchi@hikari-patent.com, kim.mcleod@ajpark.com, kimandcho@kimandcho.com, kimcheul@friends.pat.com, kimhc@danapat.com, kimhs1@21cpat.com, kimihito.washida@washida-pat.co.jp, kimspat@unitel.co.kr, kimtean@nanyanglaw.com, kimura@kimura-ip.net, kimura@kspat.gr.jp, kimura@okabeintl.gr.jp, kinutani@pop06.odn.ne.jp, kip@kippat.com, kirtimansingh@gmail.com, kiryung@kingroad.co.kr, kitamura-s@kitapat.gr.jp, kitsuya-hidetoshi@kyowapatent.co.jp, kiyopat@gold.ocn.ne.jp, kjoh@jinpat.com, kkh@kasanlaw.com, kleslie@davies.com.au, klsh@streamyx.com, klsoh@ecsf-asia.com, kmahn@ip.kimchang.com, kmkim@sunyoung.com, kmrlegal@indosat.net.id, kms@hwawoo.com, kmsuh@sungampat.com, knk@kankrishme.com, ko@sogapat.com, kobayashi@kspat.gr.jp, kobayashi@ktandi.org, kodama@kai-u.gr.jp, kogure@shigapatent.com, kogure@soei-patent.co.jp, kohno@okabeintl.gr.jp, kojima-p@suite.plala.or.jp, kok.keng.lau@rajahtann.com, konishi@miyoshipat.co.jp, koreana@koreanap.co.kr, koshikawa@tkoshi.com, kosuke.suzuki@japanipsystem.com, kowit.somwaiya@lawplusltd.com, kpc@hsip.co.kr, kpoinfo@blue.ocn.ne.jp, krcosmo@korea.com, ksayavon@laotel.com, kschun@ip.kimchang.com, kshimizu@asamura.jp, kspatent@kspatent.net, ktstulsi@hotmail.com, ktt.huong@toppat.com.vn, kubota@taniabe.co.jp, kunugipo@mb.infoweb.ne.jp, kuohua.fan@zoomlaw.net, kurauchi@arcpat.net, kurose-m34@kyowapatent.co.jp, kurose@washizupatent.com, kuzupat@kuzuwa.com, kwangnam.kim@bkl.co.kr, kwchoe@yoonyang.com, kwkoo@muhann.com, kwlaw@jonesday.com, kwon@primepat.com, kychen@tsailee.com.tw, kyoritsu@kyoritsupat.jp, kyosei@tkc.att.ne.jp, kypat@abox.so-net.ne.jp, kypeng@tsailee.com.tw, kyv07423@nifty.com, kz_watanabe@kandw-int.com, lai.lam@sw-hk.com, lallen@davies.com.au, laotrmar@laotel.com, larry@yuso.com.tw, laurel@law-isaac.com, laurence.thoo@deacons.com.hk, law@tsartsai.com.tw, law@zainassociates.com, lawchs@indosat.net.id, lawcons@bangla.net, lawfirm@sajogolaw.com, lawyers@rlolaw.com, lbhasin@gmail.com, lc@bothwin.co.kr, lcci@brain.net.pk, lee.aiming@rodyk.com, lee.patent@gmail.com, lee.pippard@sprusons.com.au, lee01@korea.com, lee@li-cai.com.tw, lee@lipc.com.hk, leeipmaster@gmail.com, leenlee@leenlee.com.sg, leepark@leepark.net, leepat2@chol.com, leepat@unitel.co.kr, leesy@leemock.com, legal@lincolnco.com.my, leolee@philonzi.com, leongwk@pc.jaring.my, lesliecruz@vasia.com, lewisho821016@yahoo.com.tw, lhipo@chollian.net, limhk@leemock.com, linda.wang@taypartners.com.my, lindsay.esler@deacons.com.hk, ling.ho@cliffordchance.com, linhthao@bdlaw.com.vn, linli@shooklin.com.my, lkmpat@hotmail.com, lkt@bakernet.com, llllanillo@syciplaw.com, lokch@pintas-ip.com, lordco@lordco.com.au, lorraine.tay@bakernet.com, low.peilin@allenandgledhill.com, lpkapunan@kapunanlaw.com, lpterrado@poblaw.com, lsblr@lakshmisri.com, lsdavar@vsnl.com, lsdel@lakshmisri.com, lsh@firstlaw.co.kr, lsmlawoffice@lsmlaw.co.id, lsn2580@chollian.net, lsp-law@rad.net.id, ltb@skrine.com, luciayiou@lcs.com.tw, ludwig.ng@onc.hk, lynell.tuffery@ajpark.com, lyu@leeandli.com, m-fujimura@fujipat.com, m-ito@miyoshipat.co.jp, m-tanaka@meilin-law.jp, m-yamagw@taiyo-nk.co.jp, m.chinquan@watermark.com.au, m.higuchi@office.email.ne.jp, m.isohata@ushio.co.jp, m.kraal@donburk.com.sg, m_shiga@shigapatent.com, m_watanabe@nakapat.gr.jp, maa@bdmail.net, maeda@aoyamapat.gr.jp, maelin@advanz.com.my, maengpat@maeng.co.kr, maggie.chong@dlapiper.com, maggielee@tsartsai.com.tw, mahinda@varners.lk, mail@annamlaw.com, mail@ascotmartin.com.au, mail@cantab-ip.com, mail@ccjslaw.com, mail@delrosariolaw.com, mail@dsb.co.th, mail@ecclesandlee.com.hk, mail@ecsf-asia.com, mail@fraserold.com.au, mail@h-iida.com, mail@hallapatent.com, mail@imansjahputra.com, mail@iplab.in, mail@knightsbridge-law.com, mail@marks-clerk.com.sg, mail@maxpat.com, mail@mccabes.co.nz, mail@naflaw.com, mail@patentattorney.com.au, mail@patinfo.com, mail@peterhuangrichard.com, mail@phoenixpat.com, mail@poblaw.com, mail@seenergiipr.com, mail@smoorenburgpini.com.au, mail@steadip.com.au, mail@taiyo-nk.co.jp, mail@taypartners.com.my, mail@wallington-dummer.com, mailbox@ipac.co.jp, mailbox@patents.jp, mainadd@sasa.gr.jp, major@macpat.net, makoto@ondatechno.co.jp, malaysia@mirandah.com, manavkumar@gmail.com, maninder@singhandsingh.com, manish@krishnaandsaurastri.com, manisha@lexorbis.com, manoj@lexorbis.com, mansoor.ali@bharuchaco.com, mansoor@advomak.com, mapobladorsr@poblaw.com, marcus@cotters.com.au, margaretlaw@leenlee.com.sg, margolis_assoc@sify.com, marklim@tpclaw.com.sg, martin.obrien@sprusons.com.au, martin.pannall@madderns.com.au, masatoshi_nishikawa@daiichi-ipo.or.jp, master@hattori.co.jp, master@jpaa.or.jp, masui-me@yuasa-hara.co.jp, matsui@okabeintl.gr.jp, matsukura@j.email.ne.jp, matsuop@po-pine.com, matsushima@ip-mandm.com, matsushita@furutani.jp, matsuura@matsuura-pat.co.jp, matthew.laight@twobirds.com, maxinechiang@leetsai.com, maxwell@maxwellhenty.com.au, mayt@yusarn.com, mcaine@davies.com.au, mcases@pldtdsl.net, mchai@mchai.com.my, mck@mspat.co.kr, mckliao@pacific.net.hk, mdoucas@henryhughes.co.nz, mearley@actuateip.com.au, menalo@wilgrist.com, menglish@marks-clerk.com.sg, merhsn@wol.net.pk, mfb@bharuchaco.com, mfederis@federislaw.com.ph, mflint@marks-clerk.com, mgkim@ip.kimchang.com, mgpaik@ip.kimchang.com, mhs@sogapat.com, mi_matsushita@nakapat.gr.jp, michael.lee@ecclesandlee.com.hk, michael@houlihan2.com, michael@mclaughlinip.com, michaelsoo@shooklin.com.my, michaelsoo@shoooklin.com.my, michele.yeoh@srl-law.com.my, midwayip@ms14.hinet.net, mieko@kipb.net, miki@shigapatent.com, mikipat@loxinfo.co.th, minatopatent@nifty.com, minervas@vnn.vn, minson@hanollawip.com, mip2@streamyx.com, mipa@tm.net.my, mipc@mipc-matsuoka.com, mirotec@hanafos.com, mitsuno@soei-patent.co.jp, miyajima-manabu@kyowapatent.co.jp, miyake@kitapat.gr.jp, miyanaga@nm-tm.jp, miz-pat@rr.iij4u.or.jp, mizuno@hikari-patent.com, mjkim26@kcllaw.com, mkc@mkcandassociates.com, mkim@kmob.com, mlmangla@ndf.vsnl.net.in, mm@mmpat.jp, mmartin@AcumenIP.com.au, mmizuno@seiwapat.co.jp, mmsmk@laotel.com, moji@bangla.net, mokano@asamura.jp, molive@fbrice.com.au, mon.esguerra@bleslaw.com, moon@mmi.co.kr, moonpat@unitel.co.kr, morisita@imypatent.jp, moritak@oslaw.org, morizumi@aoyamapat.gr.jp, mosan-1@nifty.com, motomiya@okabeintl.gr.jp, motopat@motopat.gr.jp, moyu@firstlaw.co.kr, mroberts@davies.com.au, ms@marken-patente.de, ms@mspatent.com, mspat@mspat.co.kr, msshim@ip.kimchang.com, mt-machida@kuf.biglobe.ne.jp, mtfm1921@poem.ocn.ne.jp, mtpip@mptmail.net.mm, mtpv@ccjslaw.com, mtrlaw@pacific.net.ph, mtu.pangkue@msa.hinet.net, mtvvlaw@pldtdsl.net, muhicoll@bdmail.net, mukoguchi06@fukamipat.gr.jp, mumtaz.gul@vellani.com, murabayashi@kansai-lp.com, murahashi@murahashi-tm.co.jp, murakami.t@w9.dion.ne.jp, murayama@shigapatent.com, mustafa.safiyuddin@dsklegal.com, myclaw@korea.com, n-pat@tb3.so-net.ne.jp,
 n.shimoda@seishin-ip.com, n.weno@weno.jp, n_kondo@nakapat.gr.jp, naddaporn.suwanvajukkasikij@lawplusltd.com, nadia.odorico@griffthhack.com.au, nadia@ambadar.com, nagai-hiroshi@kyowapatent.co.jp, nagashima_t@yki.jp, naina@klaw.in, nakagawa-taku@kyowapatent.co.jp, nakagawa@nakagawa.gr.jp, nakagawa@saegusa-pat.co.jp, nakamura-g06@fukamipat.gr.jp, nakamura-y@kyowapatent.co.jp, nakano@nandh-pat.com, nakata-tm@yuasa-hara.co.jp, nakatsuka@patrio.jp, nakazato@fb3.so-net.ne.jp, nampat@nampat.co.kr, nandana.i@tillekeandgibbins.com, nawoo@nawoopat.co.kr, ncc1701@mth.biglobe.ne.jp, neel.mason@mason.co.in, neeti@anandandanand.com, nfujimoto@sun-group.co.jp, nguyen-five@hcm.vnn.vn, nguyenthuanh@ambys-hanoi.com, nhhsu@tsailee.com.tw, nick.mountford@griffithhack.com.au, nigel@houlihan2.com, nikhil@klaw.in, niloygupta@rediffmail.com, nipuni@juliusandcreasy.com, nishimura@nm-tm.jp, nisio@hiroe.co.jp, nithi@mnlaw.lk, niti_dewan@rkdewanmail.com, nitin.masilamani@amarchand.com, niwapatent@nifty.com, noel.brett@griffithhack.com.au, noel.laman@cltpsj.com.ph, nomoto@nomoto-pat.com, noorhamimah@vcwl.com, nor-takan@okabeintl.gr.jp, nozue-t@gotoh-pat.com, nprasart@npjurists.com, nramchand@davies.com.au, nsgohlaw@gmail.com, nspatent@hanafos.com, nst@daejupat.com, nuno@jurismac.com, nvarma@lexapex.com, nwipo@ca.mbn.or.jp, nykwon@kimchang.com, nym@wjnt-law.com, ocbocc@philonline.com, ochi@okabeintl.gr.jp, ocmalaw@eastern.com.ph, odeza@macau.ctm.net, office@IP-iPLUS.com, office@acemark-ip.com, office@arco.chuo.kobe.jp, office@dpt.com.tw, office@hiropat.com, office@kohdapat.com, office@mission.tw, office@ono-pat.co.jp, office@plberry.co.nz, office@spco.com.au, office@ueshima-pat.jp, ogawa@tsinteco.co.jp, ogawapat@jade.dti.ne.jp, ohaiyo@ohaiyo.net, ohashiaa@da2.so-net.ne.jp, ohie@ohie-patent.jp, ohnos@oslaw.org, ohshima.kazutada@nifty.ne.jp, ohshimap@mb.infoweb.ne.jp, okabe@okabeintl.gr.jp, okada-junpei@kyowapatent.co.jp, okada@okada-patent.gr.jp, okaypat@yahoo.co.kr, okchung@nobelpat.com, okeno@arcpat.net, okimoto.non-business@yuasa-hara.co.jp, okubi@yamasaki-law.com, okuyama@quon-ip.jp, olga@ksantoso.com, olibseok@freechal.com, omahoney@collison.com.au, omana@knspartners.com, omura.noboru@nifty.ne.jp, ono.non-business@yuasa-hara.co.jp, onoand@ni.bekkoame.ne.jp, open@mail.fblaw.com.tw, opt@patest.co.jp, oshimoto@ca2.so-net.ne.jp, osuga@osuga-pat.com, ota@otapatent.com, otsuka-p@Ka2.so-net.ne.jp, otsukapat@basil.ocn.ne.jp, ozaki@unius-pa.com, pa-tsuji@itohpat.co.jp, pac86@indosat.net.id, pachubapat@hotmail.com, paf00100@nifty.com, pagan@aqanchetalaw.ph, palkr@ez-patent.co.kr, pallavi.shroff@amarchand.com, park@park-int.co.kr, parkjm@yoonpat.com, partners@boasecohencollins.com, partners@wilgrist.com, pat-ychkoyama@sun-group.co.jp, pat@kamekawa.jp, pat@patkim.com, patent.hirose@nifty.ne.jp, patent@bol.net.in, patent@deryook.com, patent@hashizume.com, patent@ipcentury.com.tw, patent@mission.tw, patent@rjipo.com, patent@towa-patent.com, patent@vcci-ip.com, patent@vsnl.com, patent@yschang.co.kr, patent_idea@yahoo.com.tw, patentattorney@dwip.com.tw, patents@vsnl.com, patfirm.kimura@nifty.ne.jp, pathay@blue.ocn.ne.jp, patkim@yoonyang.com, patmark@cyber.net.pk, patpen@patpen.co.kr, patrick_li@actionip.com, patshin@patent.co.kr, patsykoh@tpclaw.com.sg, pattarakorn.tangkaravakun@bakernet.com, paul.jones@freehills.com, paul.massey@sprusons.com.au, paul.savage@freehills.com, paulharrison@shelstonip.com, pauline.khor@rahmatlim.com, pauwang@ms16.hinet.net, pbc@pbcpartners.com, pchan@bpya.com.hk, pcw@pcwoo.com.hk, peach.ledesma@cltpsj.com.ph, peasze@yahoo.com, peckpat@kornet.net, peiyi@justuslaw.com.tw, peter.luxford@ajpark.com, peter.smith@ekmpatent.com, peter@gennia.com.tw, peterc@wray.com.au, petertreloar@shelstonip.com, phatthrawat@chavalitlaw.com, philip.thoreau@baldwins.com, phillip.pluck@adamspluck.com.au, phnompenh@epatoffice.com, pinepatcnt@naver.com, piuram@kuf.biglobe.ne.jp, pjpark@21cpat.com, pkppat@koreapat.com, plus@pluspatent.com, po.bunye@cvclaw.com, pooja@adityaandassociates.com, poojadodd@ipgurus.in, post@fclklaw.com.hk, post@hokutopat.com, postmaster@thna.com, powassoc@ksc.th.com, ppswong@pacific.net.hk, prakash@pmthakkar.com, prasantaya.bantadtan@lawplusltd.com, praw@indosat.net.id, pres@matsunaga.com, prietika@inttladvocare.com, prithipal@pacific.net.sg, pstsai@ms12.hinet.net, ptandon@indiaip.info, ptsiplaw@bdonline.com, ptsiplaw@yahoo.com, puikeng@advanz.com.my, pvtchoi@firstlaw.co.kr, pwardenhutton@fak.com.au, pwhenman@fbrice.com.au, pwplaw@indosat.net.id, qamar.uddin@bharuchaco.com, r.baddeley@watermark.com.au, r.green@watermark.com.au, r.jeevanandham@foxmandallittle.com, r_tonomura@nakapat.gr.jp, rada@infinituslaw.com.sg, rajbeer13@yahoo.com, rajendra@knspartners.com, rajeshwari@knspartners.com, rakesh.prasad@rp-patents.com, ramesh@lexorbis.com, ranjan.negi@amarchand.com, ratinuchk@mail.ilct.co.th, ravi@ipravi.com, ravi@knspartners.com, ravindran@altacit.com, ravinluan@accralaw.com, raychen@yusoipo.com.tw, rbjl@rbjl.com, rc_subedi@yahoo.com, rclark@davies.com.au, rctaleon@safalaw.com.ph, rdabas@indiaiprights.com, rebecca.lo@rlolaw.com, regina.quek@onelegal.sg, regina@markspro.com, reiko.toyosaki@nifty.com, rekim@kbkpat.com, remfry-sagar@remfry.com, remfry@bangla.net, remfry@ptcl.net, reygonzales@ccjslaw.com, rgarcia@fbrice.com.au, rhandayani@srlegals.com, rheeshph@chol.com, rhooke@fbrice.com.au, richard@lyth.co.nz, richardlau@asia.com, rikin_iplo@cbn.net.id, rikin_iplo@yahoo.com, risa-ym@rad.net.id, rm91834@alles.or.jp, rmaruyama-kyosei@art.email.ne.jp, rnarula@ipright.com, ro@patentattorney.com.au, robert.cross@pof.com.au, robert.kelson@callinans.com.au, robert.miller@sprusons.com.au, robert.wulff@griffithhack.com.au, robert@createip.co.nz, rogelio.nicandro@romulo.com, rommanet@scg.co.th, romulo@romulo.com, rosa.pang@aar.com.au, rosita.li@mayerbrownjsm.com, ross.mcfarlane@pof.com.au, rpv@vera-iplaw.com, rselvam@selvamandselvam.in, rssantos@platonmartinez.com, ruby.chan@bakernet.com, ruby@rubyyeung.com, rueysentsai@leeandli.com, russelldavies@shelstonip.com, rusvectp@ms2.hinet.net, rvdlaw@pldtdsl.net, rwinata@winata-gautama.com, rylee@firstlaw.co.kr, s-fujitani@mist.dti.ne.jp, s-kato@aiklaw.co.jp, s-nagaoka@fujipat.com, s-sitara@taiyo-nk.co.jp, s-tsutsui@tsutsui-pat.com, s.thurairaja@mnlaw.lk, s5-shimizu@hhc.eisai.co.jp, s_hayashi@asamura.jp, s_itoh@itohshin.or.jp, s_nakao@nakaoitopatent.com, s_tanaka@nakapat.gr.jp, saad@hamayuns.com, sadaki.igarashi@nifty.com, saegusa@saegusa-pat.co.jp, saeki.yoshifumi@shigapatent.com, safir@anandandanand.com, sai@saikrishnaassociates.com, saichi.suyama@sakura-pat.com, saifong@shearndelamore.com, saipat@da2.so-net.ne.jp, saira.osman@bharuchaco.com, saito@creia-pat.com, saito@inspire-ip.com, sak@primeworks-ip.com, sakai-m06@fukamipat.gr.jp, sakuma@esakipat.co.jp, sakuragi@sakuragipatent.com, sam@dlplaw.com.sg, samejima@aoyamapat.gr.jp, samiya.fikree@vellani.com, samsonwong.office@sw-hk.com, samsoo@dreamwiz.com, san-a@san-a-pat.com, sana.shaikh@vellani.com, sanchitaganguli@yahoo.com, santosh.singh@foxmandallittle.com, saravanan.neelakandan@mnlaw.lk, sardinha@ccadvog.com, sas@zain.com.my, sasaki-m06@fukamipat.gr.jp, satoshi@kabasawa.com, satyapon@satyapon.com, saud.alvi@vellani.com, say.sujintaya@bakernet.com, saya@singhandsingh.com, sbahn@yschang.co.kr, sbirt@rsrbhk.com, scheung@fzimmern.com.hk, sclee@hnpat.com, scott.berggren@sprusons.com.au, scott.walker@ekmpatent.com.au, scottv@wray.com.au, sd.villanueva@cvclaw.com, sdh1@shinwonpat.com, sdk@bkl.co.kr, sdlee88@gmail.com, sdlee@cnspat.com, sdoan@iprights.com, sdpark@ip.kimchang.com, seanfan@tsartsai.com.tw, sebastian.hughes@troutmansanders.com, secur575@ms75.hinet.net, seema.mansoor@vellani.com, seiji.ota@kitapat.com, sejunoh@krpatent.co.kr, sekine@shuwa.net, seleneng@wilgrist.com, selly-ls@rad.net.id, senda@kisaragi.gr.jp, senmark@cal2.vsnl.net.in, seongkik@leeinternational.com, sera@shuwa.net, service@asianpacific.com.tw, sfks@sfks.com.hk, shahn@hanapat.co.kr, shahnaz.irani@sprusons.com.au, shahslaw@hotmail.com, shamoto-ch@yuasa-hara.co.jp, shc6495@chollian.net, shehara.varia@fjgdesaram.com, sheikhbr@super.net.pk, shengwui@ms10.hinet.net, shhong@ez-patent.co.kr, shimizu@soei-patent.co.jp, shimizu@xebec-pro.com, shindy@muhann.com, shinohara@skpat.jp, shintani@siks.jp, shiotani-m@kyowapatent.co.jp, shiozawa@siks.jp, shiraz@duaassociates.com, shivani@duaassociates.com, shjung@eruum.com, shkim1@ip.kimchang.com, shlee@rothwellfigg.com, shnam@einpat.com, shnoh@cnspat.com, sho-pat@remus.dti.ne.jp, shoaib.mansoor@vellani.com, shohei.oguri@eikoh-patent.gr.jp, showa@tokkyo.co.kr, shumanto@nicheintellectualproperty.com, shunji.miyama@nifty.com, shupatnt@shupat.gr.jp, shuva.mandal@foxmandallittle.com, shwetambari@krishnamurthyandco.com, shyoon@ip.kimchang.com, shysun@vsnl.com, siasia@loxinfo.co.th, siewhong@infinituslaw.com.sg, siewling.su@taypartners.com.my, siewling@advanz.com.my, siiplo@mail.saint-island.com.tw, simadalp@msh.biglobe.ne.jp, simoncheung@cheungandchoy.com, singapore@mirandah.com, singhandsingh@vsnl.com, sinhasurabhi81@rediffmail.com, siva@blr.vsnl.net.in, sivanas@nd-ip.com, siwamiya@iwamiya.com, sjjeong@firstlaw.co.kr, sjkim@lnkip.com, 
 davido.extraxim@gmail.com